Job Responsibilities:
1. Participate the design review of new PCBa product and have a SMT DFM know-how to review and conduct PCBa layout design to avoid potential manufacture risk.
2. Lead NPI introduction of new PCBa products to SMT Line production to realize SOP.
3. Validate the pre-serial and the new SMT processes.
4. Lead or Participate to new SMT process and new SMT equipment introduction.
5. Lead or Participate SMT indirect material evaluation and introduction for cost down.
6. Design and make solder paste or glue stencil, support template.
7. Set up the pick and place support pin template and fixture to guarantee the production with good quality and output.
8. Create solder paste printing program, SMT pick and place program, set up reflow oven and selective wave soldering temperature profile.
9. Lead to create working instruction, parameters folders for above process.
10. Define relative technical spec and create SMT process procedure document.
11. Support SPI/AOI engineer to finish SPI and AOI program setup/debug/optimization.
12. Participate to IATF 16949 and create PFMEA for PPAP audit.
13. Support Production and Maintenance till the rump up of the new equipment/process, guaranteeing the achievement of the stated levels of compliance and efficiency/quality required.
14. SMT process continuous improvements on process optimization, equipment setup and so on. use Kaizen tools to solve problem.
15. Correctly use the Valor MES system to implement routing setup requirement.
16. Train the technicians and operators.
17. Support Maintenance, also basing on suppliers’ reports, about the critical spare parts for the preservation of machineries’ efficiency.
18. Pro**e and implement (with the suppliers’ help, both internal and external, internal tooling people) technical changes focused to the constant process improvement so to decrease scraps and losses Pro**e and implement (also with the help from the internal analysts, external suppliers and / or maintenance people, internal tooling people) changes on the job cycle focused on the constant process improvement in order to reach the efficient job cycle itself objectives.
19. Require and coordinate the extraordinary interventions by the suppliers and / or maintenance people, internal tooling people in case of equipment’s accidental breaks.
20. Verify and guarantee the safety level for the equipment by promptly highlighting, to the safety manager, the non–conformities both technical and managerial.
21. Identify the optimal parameters of the various processes.
22. For SOPed project, need focus on FPY, cycle time optimization, production efficiency improvement, breakdown time, FTQ and scrap reduction and so on.
23. Work timely on other tasks as assigned by the Dept. Manager and supervisor.
Qualifications/Required experience:
1. University diploma;
2. Minimum 5 years of experience on the SMT process and SMT equipment follows ;
3. Rich experience on SMT stencil manufacture, solder paste printing, SPI, Pick & place process, reflowing process and AOI process;
4. Good skills on MS-Office software, CAM350, GC-PowerStation;
5. Good communication of English in both spoken and written;
6. Prefer to know SMT equipment such as DEK/ERKA printer, Koh-Young SPI, Fuji NXT and XPF, ERSA oven and Omron 3D AOI and so on.
更新时间: 2024/11/30
更新时间: 2024/11/27
更新时间: 2024/11/18
更新时间: 2024/11/18
更新时间: 2024/11/18